Defect characterization in semiconductor devices based on image processing
AssigneeMicron Technology, Inc.
InventorNagasubramaniyan Chandrasekaran
Life of this patent
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Abstract
A system includes a memory and a processing device, operatively coupled with the memory, to perform operations including: receiving an image of a substrate of an electronic device; extracting, by a feature extraction model processing the image, a plurality of visual features from the image; and identifying, by a trainable feature classifier processing the plurality of visual features, a region of interest corresponding to an electronic circuit associated with performance of the electronic circuit.
Claims19
A system comprising:
- a memory;
- and
- a processing device, operatively coupled with the memory, to perform operations comprising:
- receiving an image of a substrate of an electronic device, the image covering an area of the substrate, wherein a critical measurement of the substrate is calculated as an aggregated value over the area;
- determining a plurality of candidate regions in the image based on sampling information associated with the critical measurement, wherein the sampling information specifies a plurality of sampling locations within the area, and wherein values measured at the plurality of sampling locations are used to calculate the aggregated value;
- extracting, by a feature extraction model processing the image, a plurality of visual features from the image;
- and
- identifying, by a trainable feature classifier processing the plurality of visual features extracted by the feature extraction model, a region of interest among the plurality of candidate regions, the region of interest corresponding to an electronic circuit and associated with performance of the electronic circuit.
A non-transitory computer readable medium comprising instructions, which when executed by a processor, cause the processor to perform operations comprising:
- receiving an image of a semiconductor substrate of an electronic device, the image covering an area of the substrate, wherein a critical measurement of the substrate is calculated as an aggregated value over the area;
- determining a plurality of candidate regions in the image based on sampling information associated with the critical measurement, wherein the sampling information specifies a plurality of sampling locations within the area, and wherein values measured at the plurality of sampling locations are used to calculate the aggregated value;
- extracting, by a feature extraction model processing the image, a plurality of visual features from the image;
- and
- identifying, by a trainable feature classifier processing the plurality of visual features extracted by the feature extraction model, a region of interest among the plurality of candidate regions, the region of interest corresponding to an electronic circuit exhibiting suboptimal performance.
A method, comprising:
- receiving, by a processing device, an image of a substrate of an electronic device, the image covering an area of the substrate, wherein a critical measurement of the substrate is calculated as an aggregated value over the area;
- determining a plurality of candidate regions in the image based on sampling information associated with the critical measurement, wherein the sampling information specifies a plurality of sampling locations within the area, and wherein values measured at the plurality of sampling locations are used to calculate the aggregated value;
- extracting, by a feature extraction model processing the image, a plurality of visual features from the image;
- and
- identifying, by a trainable feature classifier processing the plurality of visual features extracted by the feature extraction model, a region of interest among the plurality of candidate regions, the region of interest corresponding to an electronic circuit associated with performance of the electronic circuit.
Dependencies are inferred from the claim text.