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US 12,761,430 B2Granted
Package structure having photonic integrated circuit
AssigneeMolex Incorporated
InventorsChih-Chung Hsu, Chih-Chung Wu, Zuon-Min Chuang, Chih-Wei Peng
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
Claims14
A package structure, comprising:
- a substrate having a recessed portion;
- an optical waveguide connection assembly separate from the substrate, the optical waveguide connection assembly suspended over, and extending into, the recessed portion;
- and
- a chip having an optical waveguide structure, the chip connected with the optical waveguide connection assembly via the optical waveguide structure,
- wherein the optical waveguide connection assembly is configured to couple an optical fiber to the optical waveguide structure.
2 more elements
An optical device, comprising:
- a light source;
- a lens;
- and
- an optical waveguide connection assembly configured to be connected with a chip that is engaged to a substrate, the optical waveguide connection assembly separate from the substrate,
- wherein the optical waveguide connection assembly is suspended over, and extends into, a recessed portion of the substrate, and
- wherein the optical waveguide connection assembly is configured to couple an optical fiber to an optical waveguide structure of the chip.
3 more elements
Dependencies are inferred from the claim text.