Pressure-sensitive ink, flexible pressure sensing structure, and electronic device

A flexible pressure sensing structure, comprising:

• an insulating layer, a pressure strain layer, and a conductive layer stacked in a sequential order, wherein the pressure strain layer comprises:
• a matrix;
• conductive particles dispersed in the matrix;
• and
• inorganic fillers dispersed in the matrix, wherein the inorganic fillers comprise hydrophobic groups, each of the inorganic fillers further comprises a core and a shell on the core, the hydrophobic groups are connected to a surface of the shell, and the core defines at least one hollow structure.

An electronic device, comprising:

• a circuit board comprising at least one flexible pressure sensing structure, each of the at least one flexible pressure sensing structure comprising:
• an insulating layer, a pressure strain layer, and a conductive layer stacked in a sequential order, wherein the pressure sensing layer is electrically connected to a circuit layer of the circuit board through the conductive layer, the pressure strain layer comprising:
• a matrix;
• conductive particles dispersed in the matrix;
• and
• inorganic fillers dispersed in the matrix, wherein the inorganic fillers comprise hydrophobic groups, each of the inorganic fillers further comprises a core and a shell on the core, the hydrophobic groups are connected to a surface of the shell, and the core defines at least one hollow structure.