Sensor package structure and sensing module thereof

A sensor package structure, comprising:

• a substrate;
• a sensor chip disposed on and electrically coupled to the substrate, wherein a top surface of the sensor chip has a sensing region and a carrying region that surrounds the sensing region;
• a ring-shaped supporting layer disposed on the carrying region of the sensor chip and surrounding the sensing region, wherein the ring-shaped supporting layer includes a plurality of strip segments and a plurality of rounded corner segments, and any two of the strip segments adjacent to each other are connected through one of the arc-shaped segments;
• a light-permeable layer disposed on the ring-shaped supporting layer, wherein the light-permeable layer, the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space, and wherein an inner surface of the light-permeable layer has:
• a plurality of straight edges respectively arranged adjacent to and parallel to the strip segments, and wherein any one of the straight edges is spaced apart from an adjacent one of the strip segments by a first inward distance;
• and
• a plurality of rounded corners respectively arranged adjacent to the arc-shaped segments, wherein any two of the straight edges adjacent to each other are connected through one of the rounded corners, and wherein any one of the rounded corners is spaced apart from an adjacent one of the arc-shaped segments by a second inward distance that is within a range from 95% to 105% of the first inward distance;
• and
• an encapsulant formed on the substrate, wherein the sensor chip, the ring-shaped supporting layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer arranged away from the substrate is at least partially exposed from the encapsulant.