Three-dimensional vapor chamber bonding structure

A three-dimensional vapor chamber bonding structure, comprising:

• a housing, comprising a first shell plate and a second shell plate hermetically sealed with each other, wherein a cavity is defined between the first shell plate and the second shell plate, the second shell plate comprises a plurality of through-holes, and each of the through-holes is surrounded by a recessed groove;
• a plurality of heat pipes, respectively inserted in the through-holes, each of the heat pipes comprising an open end, a flange disposed on each of the open ends, the flange received in the recessed groove, wherein each of the heat pipes is joined to the second shell plate through the flange and a weldment in the recessed groove;
• a capillary member, disposed in the cavity and adhered to the housing;
• and
• a working fluid, contained in the cavity;
• wherein the recessed groove comprises an inner peripheral surface, the flange comprises an outer peripheral surface, and the weldment formed by laser welding is disposed between the outer peripheral surface and the inner peripheral surface;
• wherein the second shell plate comprises a top plate, a protrusion is positioned higher than an outer surface of the top plate and is disposed corresponding to the recessed groove, and a ring wall extends upward from the protrusion;
• wherein a lower surface of the flange is coplanar with or lower than an inner surface of the top plate of the second shell plate.