Electroplating conductive fixture
AssigneesChipmore Technology Corporation Limited, Hefei Chipmore Technology Co., Ltd.
InventorJisheng Huo
Life of this patent
Estimating the term…
Loading patent…
AssigneesChipmore Technology Corporation Limited, Hefei Chipmore Technology Co., Ltd.
InventorJisheng Huo
Estimating the term…
The present invention provides an electroplating conductive fixture, comprising a base, a top cover and a conductive column. The bottom of the conductive column penetrates the base. A first guide part is arranged on the base. A second guide part is arranged on the conductive column. At least one of the first guide part and the second guide part extends in the shape of spiral from bottom to top. The bottom of the conductive column is provided with a scraper. In the present application, the scraper at the bottom of the conductive column is used to clean crystals on a conductive piece, which ensures good contact and improves the stability of a current and voltage during an electroplating process.
An electroplating conductive fixture, comprising:
An electroplating conductive fixture, comprising a base and a lifting-type conductive column mounted within the base, wherein the conductive column and the base cooperate with each other via a guide portion having a spiral shape, such that the conductive column rotates while being lifted;
Dependencies are inferred from the claim text.