Resin composition for adhesive layer, and multilayer tube
AssigneesToray Industries, Inc., Polyplastics-Evonik Corporation
InventorsTakuya Ochiai, Yosuke Onoue, Rei Sato, Kazuya Okubo
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AssigneesToray Industries, Inc., Polyplastics-Evonik Corporation
InventorsTakuya Ochiai, Yosuke Onoue, Rei Sato, Kazuya Okubo
Estimating the term…
The present disclosure relates to a resin composition for an adhesive layer. The resin composition contains: a polyphenylene sulfide-based resin (A); a polyamide resin (B); a first thermoplastic resin (C) containing at least one type of functional group selected from the group consisting of an epoxy group, an acid anhydride group, a carboxyl group, a carboxylic acid salt, and a carboxylic acid ester; and a second thermoplastic resin (D) that is free of epoxy groups, acid anhydride groups, carboxyl groups, carboxylic acid salts, and carboxylic acid esters. The resin composition contains, with respect to 100 parts by weight of the polyphenylene sulfide-based resin (A), from 80 to 300 parts by weight of the polyamide resin (B), from 20 to 200 parts by weight of the first thermoplastic resin (C), and from 10 to 100 parts by weight of the second thermoplastic resin (D), and a terminal amino group concentration of the polyamide resin (B) is from 48 to 120 mmol/kg.
A resin composition for an adhesive layer, the resin composition comprising:
Dependencies are inferred from the claim text.