Photosensitive resin composition, cured product thereof and multilayer material

Abstract

A resin composition contains a maleimide compound (I) that is the product of a reaction between a diamine (a-1) derived from a dimer acid and maleic anhydride, and a reactive polycarboxylic acid resin (II) that is the product of a reaction between a reactive epoxycarboxylate resin, the reactive epoxycarboxylate resin being the product of a reaction between an epoxy resin (b-1) and a compound (b-2) having a polymerizable ethylenically unsaturated group and a carboxy group together in one molecule, and a polybasic acid anhydride (b-3).

Dependencies are inferred from the claim text.