Antimicrobial phenolic fatty acid-based epoxy curing agents for polymers

Abstract

Composition and methods for killing microorganisms using antimicrobial epoxy polymers and epoxy polymer curing agents are described. Compositions containing at least one compound of formula I where R1 is a phenolic group (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition.

Dependencies are inferred from the claim text.