Method and arrangement for forming grooves in a board element
AssigneeCeraloc Innovation AB
InventorsPer Josefsson, Martin Bjeremyr, Richard Jolfson
Life of this patent
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Abstract
A method for forming at least one groove in a board element, wherein the board element includes a polymer-based material and, preferably, a filler. The method includes providing a board element including a board portion disposed at an elevated temperature and forming at least one groove by removing material, such as chips, from the board portion by a processing device.
Claims13
A method for forming at least one groove in a board element, said board element comprising a thermoplastic material, wherein the board element is provided in a form of a panel or is dividable into at least two panels, each panel being a floor panel or a wall panel, the method comprising:
- forming the board element under heat,
- providing the board element comprising a board portion disposed at an elevated temperature, said elevated temperature being obtained during said forming of the board element under heat, wherein said board portion comprises the thermoplastic material, wherein the elevated temperature exceeds 25° C., and
- forming said at least one groove by removing material from the board portion disposed at the elevated temperature by a processing device,
- wherein the removing of the material from the board portion includes cutting or chipping the material away from the board element when the board portion is disposed at the elevated temperature, and
- wherein the forming of the at least one groove forms a groove bottom recessed from a face of the board portion and at least two opposing lateral walls of the groove extending from the face of the board portion to the groove bottom.
Dependencies are inferred from the claim text.