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US 12,759,204 B2Granted
Manufacturing method of housing structure of electronic device
AssigneesAcer Incorporated, NanPao New Materials Technology (Huaian) Co., Ltd.
InventorsPin-Chueh Lin, Wen-Chieh Tai, Cheng-Nan Ling, Chang-Huang Huang
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Abstract
A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stacked after the painting layer washes and squeezes at least a portion of the flowing painting layer to form a random texture pattern.
Claims7
A manufacturing method of housing structure of electronic device, comprising:
- stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers, wherein the painting layer is in a molten state while being disposed on the first structural layer, and the second structural layer washes and squeezes the painting layer when the painting layer is not completely solidified to form a random texture pattern, wherein the first structural layer and the second structural layer are formed by secondary injection molding with a same mold, wherein the first structural layer is an internal member of the housing structure of the electronic device, and the second structural layer is an externally transparent member of the housing structure of the electronic device.
Dependencies are inferred from the claim text.