Polishing method, and polishing apparatus

A polishing apparatus, comprising:

• a polishing table for supporting a polishing pad;
• a polishing head configured to press a substrate against a surface of the polishing pad so as to polish the substrate;
• a pad-temperature measuring device configured to measure a temperature of the polishing surface;
• a pad-temperature regulating apparatus configured to regulate the temperature of the polishing surface;
• a film-thickness measuring device mounted to the polishing table;
• and
• a controller configured to control operations of at least the polishing head and the pad-temperature regulating apparatus,
• wherein the controller is configured to:
• press the substrate against the polishing surface at an arbitrary pressure without controlling a polishing load for pressing the substrate against the polishing surface based on measurement values from the film-thickness measuring device, while heating the polishing surface, until reaching a predetermined temperature, by use of the pad-temperature regulating apparatus based on measurement values from the pad-temperature measuring device;
• and
• after the temperature of the polishing surface reaches the predetermined temperature, polish the substrate while maintaining the temperature of the polishing surface at the predetermined temperature and controlling the polishing load based on the measurement values from the film-thickness measuring device.