Bond head heater incorporating fluid chamber for cooling

A cooling system for a bond head heater including a heater plate that is operative to heat a die that is being held adjacent to the bond head heater, the cooling system comprising:

• at least one fluid chamber, the at least one fluid chamber including an enclosure for containing a fluid, the at least one fluid chamber being thermally coupled to the heater plate to allow heat transfer by thermal conduction;
• a fluid inlet and a fluid outlet coupled to the at least one fluid chamber such that fluid is introduced into the at least one fluid chamber through the fluid inlet and exhausted from the at least one fluid chamber through the fluid outlet;
• a heat transmission path lying substantially next to the heater plate through which the fluid is configured to flow when the fluid is travelling between the fluid inlet and the fluid outlet, and a partition positioned within the enclosure to define the heat transmission path to increase a flow speed of the fluid as it passes the heater plate.