Memory and fabrication method thereof and memory system
AssigneeYangtze Memory Technologies Co., Ltd.
InventorZhaoyun Tang
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AssigneeYangtze Memory Technologies Co., Ltd.
InventorZhaoyun Tang
Estimating the term…
The present disclosure discloses a memory device, a method for fabricating a memory device, and a memory system. The method includes: forming a plurality of semiconductor bodies spaced apart and forming spacing portions between adjacent semiconductor bodies, where the plurality of semiconductor bodies extend along a first direction; removing part of the plurality of semiconductor bodies to form a plurality of first grooves between adjacent first spacing portions; forming mask portions protruding out from the first grooves within the first grooves, to form second grooves between adjacent mask portions; forming spacer portions within the second grooves and removing the mask portions to form third grooves between adjacent second spacer portions; and forming conductive connection portions connected to the semiconductor bodies along the first direction within the third grooves.
A memory device, comprising:
A memory system, comprising:
Dependencies are inferred from the claim text.