US 12,757,683 B2 · Electrostatic chuck having a dielectric substrate and method of manufacturing

Abstract

Provided is an electrostatic chuck member including: a dielectric substrate having a placement surface on which a sample is mounted, wherein the dielectric substrate comprises a first supporting plate and a second supporting plate which are stacked in a thickness direction thereof; and an adsorption electrode embedded in the dielectric substrate, in which a gas flow path is provided by a recessed groove, which is provided between the first supporting plate and the second supporting plate which have surfaces facing each other, wherein the recessed groove is formed in at least one of the surfaces thereof and is covered with the other thereof, a dimension of the gas flow path in a height direction is 90 μm or more and 300 μm or less, and a width dimension of the gas flow path is 500 μm or more and less than 3000 μm.

Claims20

Dependent claims

An electrostatic chuck member comprising:

a dielectric substrate having a placement surface on which a sample is mounted, wherein the dielectric substrate comprises a first supporting plate and a second supporting plate which are stacked in a thickness direction thereof;
and
an adsorption electrode which is embedded in the dielectric substrate,
wherein a gas flow path is provided with a recessed groove, which is provided between the first supporting plate and the second supporting plate which have surfaces facing each other, wherein the recessed groove is formed in at least one of the surfaces thereof and is covered with the other thereof,
a dimension of the gas flow path in a height direction is 90 μm or more and 300 μm or less, and
a width dimension of the gas flow path is 500 μm or more and less than 3000 μm.

3 more elements

A method for manufacturing an electrostatic chuck member which includes a dielectric substrate, which includes a first supporting plate, a second supporting plate, and a joining layer disposed between the first supporting plate and the second supporting plate, and an adsorption electrode embedded in the dielectric substrate, the method comprising:

a recessed groove forming step of forming a recessed groove in the first supporting plate;
an application step of applying a joining layer paste to at least one of the first supporting plate and the second supporting plate;
and
a joining step of stacking the first supporting plate and the second supporting plate in a thickness direction thereof through the joining layer paste, and joining the first supporting plate and the second supporting plate by heating and pressurizing them,
wherein a heat treatment temperature in the joining step is 1700° C. or higher.

2 more elements

Dependencies are inferred from the claim text.

Electrostatic chuck having a dielectric substrate and method of manufacturing

Life of this patent

Electrostatic chuck having a dielectric substrate and method of manufacturing

Life of this patent

Abstract

Claims20