Fan assembly, heat dissipation assembly and electronic device

A heat dissipation assembly, comprising:

• a fan assembly, comprising:
• a casing, having an inner surface, an inlet and at least two outlets, wherein the inner surface is connected to the at least two outlets, and the inlet is in fluid communication with the at least two outlets;
• an impeller, rotatably disposed on the casing, wherein the inner surface faces the impeller;
• and an air collecting component entirely disposed in one of the at least two outlets and having an air collecting surface, wherein the air collecting surface faces the impeller, the air collecting surface is connected to the inner surface, the air collecting surface and the inner surface form a gap together with the impeller, the gap is gradually widened along a rotating direction of the impeller from a side of the air collecting surface opposite to the inner surface to a side of the inner surface opposite to the air collecting surface, and the air collecting component is configured to guide an airflow blown by the impeller to another one of the at least two outlets via the gap;
• at least one heat sink, disposed adjacent to one of the at least two outlets;
• and a disturbing component, covering at least a part of the outlet where the air collecting component is disposed.

An electronic device, comprising:

• a housing;
• a motherboard assembly, comprising a motherboard and at least one heat source, wherein the motherboard is disposed in the housing, and the heat source is disposed on the motherboard;
• a fan assembly, disposed in the housing and comprising:
• a casing, having an inner surface, an inlet and at least two outlets, wherein the inner surface is connected to the at least two outlets, and the inlet is in fluid communication with the at least two outlets;
• an impeller, rotatably disposed on the casing, wherein the inner surface faces the impeller;
• and an air collecting component entirely disposed in one of the at least two outlets and having an air collecting surface, wherein the air collecting surface faces the impeller, the air collecting surface is connected to the inner surface, the air collecting surface and the inner surface form a gap together with the impeller, the gap is gradually widened along a rotating direction of the impeller from a side of the air collecting surface opposite to the inner surface to a side of the inner surface opposite to the air collecting surface, and the air collecting component is configured to guide an airflow blown by the impeller to another one of the at least two outlets via the gap;
• at least one heat sink, disposed in the housing and disposed adjacent to one of the at least two outlets;
• and a disturbing component, disposed in the housing and covering at least a part of the outlet where the air collecting component is disposed.