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US 12,751,242 B2Granted
Cover for a wafer
AssigneeViavi Solutions Suzhou Co., Ltd.
InventorsLiang Zhou, Ling Liu
Life of this patent
Estimating the term…
Abstract
In some implementations, a cover for a wafer that is on a wafer frame includes a top portion configured to span an entirety of a top surface of the wafer; and a side portion configured to span an entirety of a side surface of the wafer, wherein the side portion extends at a non-zero angle from the top portion to allow the cover to enclose the wafer on the wafer frame. In some implementations, a carrier for a wafer includes the wafer, the wafer frame, and the cover.
Claims20
A cover for a wafer that is on a wafer frame, comprising:
- a top portion configured to span an entirety of a top surface of the wafer comprising one or more dies, the top portion being separated from the one or more dies by a free-space gap;
- a side portion configured to span an entirety of a side surface of the wafer,
- wherein the side portion extends at a non-zero angle from the top portion to allow the cover to enclose the wafer on the wafer frame;
- and
- a flange portion extending at a non-zero angle from the side portion and extending over at least a portion of the wafer frame,
- wherein the flange portion includes one or more interaction components disposed on an outer surface of the flange portion, the one or more interaction components comprising one or more tabs that are aligned with one or more orientation components comprising one or more indentations of the wafer frame to facilitate gripping of the one or more tabs, to enable placement and removal of the cover over the wafer on the wafer frame.
3 more elements
A carrier for a wafer, comprising:
- the wafer;
- a wafer frame;
- and
- a cover, wherein:
- the wafer is disposed on the wafer frame,
- a top portion of the cover spans an entirety of a top surface of the wafer comprising one or more dies, the top portion being separated from the one or more dies by a free-space gap;
- a side portion of the cover spans an entirety of a side surface of the wafer, wherein the cover encloses the wafer on the wafer frame;
- and
- a flange portion of the cover extends at a non-zero angle from the side portion and extends over at least a portion of the wafer frame,
- wherein the flange portion includes one or more interaction components disposed on an outer surface of the flange portion, the one or more interaction components comprising one or more tabs that are aligned with one or more orientation components comprising one or more indentations of the wafer frame to facilitate gripping of the one or more stabs, to enable placement and removal of the cover over the wafer on the wafer frame.
7 more elements
A carrier for a wafer, comprising:
- a cover, wherein:
- a top portion of the cover spans an entirety of a top surface of the wafer comprising one or more dies, the top portion being separated from the one or more dies by a free-space gap;
- a side portion of the cover spans an entirety of a side surface of the wafer, wherein the side portion extends from the top portion to allow the cover to enclose the wafer on a wafer frame of the carrier;
- and
- a flange portion of the cover extends at a non-zero angle from the side portion and extends over at least a portion of the wafer frame,
- wherein the flange portion includes one or more interaction components disposed on an outer surface of the flange portion, the one or more interaction components comprising one or more tabs that are aligned with one or more orientation components comprising one or more indentations of the wafer frame to facilitate gripping of the one or more tabs, to enable placement and removal of the cover over the wafer on the wafer frame.
3 more elements
Dependencies are inferred from the claim text.