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US 12,747,367 B2Granted
Payment structure with PCM material
AssigneeApt Asia Pacific Pty. Ltd.
InventorsJames Michael Tritt, Robert Corbo, Sumeet Luddu
Life of this patent
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Abstract
A floor pavement structure exhibiting resistance to overheating, the floor pavement structure comprising at least one layer containing a phase change material. The floor pavement structure may further comprise a heat conductive sub-layer including graphite, graphene or combinations thereof, the heat conductive sub-layer being disposed between the phase change material containing layer and a substrate.
Claims18
A floor pavement structure comprising:
- at least one phase change material (PCM) layer comprising at least one PCM in an effective amount to prevent overheating of the floor pavement structure, wherein the at least one PCM layer comprises a first PCM layer and a second PCM lavers. the second PCM layer being disposed on the first POM layer;
- wherein the first POM layer comprises at least one first POM,
- wherein the second PCM layer comprises at least one second PCM, and
- wherein the second PCM layer is a top layer of the floor pavement structure.
1 more element
A floor pavement structure comprising:
- at least one phase change material (PCM) layer comprising at least one PCM in an effective amount to prevent overheating of the floor pavement structure,
- a plurality of sub-layers comprising at least one heat conductive sub-layer comprising a heat conductive material,
- wherein the plurality of sub-layers are disposed between the at least one PCM and a substrate,
- wherein the heat conductive material comprises graphite, graphene or a combination thereof, and
- wherein the heat conductive material is dispersed within a polyurethane (PU) or acrylic resin material
- wherein the graphite is nano-graphite with a content of the nano-graphite ranging from 5.0 to 15.0% by weight based on a total weight of the at least one heat conductive sub-layer.
3 more elements
A method of constructing a floor pavement structure, the method comprising:
- forming at least one PCM layer over at least one sub-layer, the at least one PCM layer containing at least one PCM in an effective amount to prevent overheating of the floor pavement structure;
- forming a second PCM layer over the a first PCM layer of the at least one PCM layer, wherein the second PCM layer is a top layer of the floor pavement structure.
Dependencies are inferred from the claim text.