Composite substrate, manufacturing method thereof and semiconductor device
AssigneeEnkris Semiconductor (Wuxi), Ltd.
InventorKai Cheng
Life of this patent
Estimating the term…
Loading patent…
AssigneeEnkris Semiconductor (Wuxi), Ltd.
InventorKai Cheng
Estimating the term…
A composite substrate includes a supporting substrate layer, a buried layer and a growth substrate layer stacked in sequence. The buried layer is provided with a plurality of grooves at least partially penetrating the buried layer, the supporting substrate layer includes a charge trapping region beneath the plurality of grooves, and on a plane where the supporting substrate layer is located, shapes of projections of the charge trapping region and a corresponding groove overlap. The charge trapping region is arranged on the supporting substrate layer, and the charge trapping region is used to deplete charges of the supporting substrate layer, so as to increase resistivity of the composite substrate, reducing an impact of crosstalk; and the buried layer is provided with grooves, which may attenuate a stress transmitted from the growth substrate layer to the supporting substrate layer, so as to enhance a mechanical strength of the composite substrate.
A composite substrate, comprising:
A semiconductor device, comprising:
A method for manufacturing a composite substrate, comprising the steps of:
Dependencies are inferred from the claim text.