Semiconductor structure and method of forming the same
AssigneeWinbond Electronics Corp.
InventorsShou-Chi Tsai, Kai Jen
Life of this patent
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AssigneeWinbond Electronics Corp.
InventorsShou-Chi Tsai, Kai Jen
Estimating the term…
A semiconductor structure and a method of forming the same are provided. The semiconductor structure includes a first work function layer, a second work function layer, a protective layer, a gate stack, a first liner, a second liner, a planarization layer, and a gate plug. The first work function layer is disposed on a substrate. The second work function layer is disposed on the first work function layer. The protective layer is disposed on the second work function layer. The gate stack is disposed on the protective layer. The first liner is disposed on the gate stack. The second liner is disposed on the first liner. The planarization layer is disposed on the second liner. The gate plug is disposed on the planarization layer and in contact with the first work function layer and the second work function layer.
A semiconductor structure, comprising:
A method of forming a semiconductor structure, comprising:
Dependencies are inferred from the claim text.