Semiconductor device comprising a connecting layer including an array of connecting pads and a capacitive structure
AssigneeFujian Jinhua Integrated Circuit Co., Ltd.
InventorsYu-Cheng Tung, Janbo Zhang
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Abstract
A semiconductor device includes a substrate, a connecting layer on the substrate, and a capacitor structure arranged on the connecting layer. The connecting layer includes an array of connecting pads, a peripheral structure adjacent to the array of connecting pads, and a plurality of first extending pads arranged between the peripheral structure and the array of connecting pads. The connecting pads respectively have one of the bottom electrodes of the capacitor structure disposed thereon. The first extending pads respectively have two of the bottom electrodes of the capacitor structure disposed thereon to reinforce the peripheral portions of the capacitor structure.
Claims19
A semiconductor device, comprising:
- a substrate;
- a connecting layer on the substrate and comprising:
- an array of connecting pads comprising a plurality of connecting pads arranged along a first direction and a second direction and separated from each other;
- a peripheral structure comprising a first edge and a second edge adjacent to two adjacent sides of the array of connecting pads;
- and
- a plurality of first extending pads arranged between the first edge of the peripheral structure and the array of connecting pads;
- and
- a capacitor structure comprising a plurality of bottom electrodes disposed on the connecting layer, wherein the connecting pads respectively have one of the bottom electrodes disposed thereon, the first extending pads respectively have at least two of the bottom electrodes disposed thereon.
A semiconductor device, comprising:
- a substrate;
- a connecting layer on the substrate and comprising:
- an array of connecting pads comprising a plurality of connecting pads arranged along a first direction and a second direction;
- a peripheral structure comprising a first edge and a second edge adjacent to two adjacent sides of the array of connecting pads;
- and
- a plurality of first extending pads and second extending pads alternately arranged between the first edge of the peripheral structure and the array of connecting pads, wherein along the first direction, lengths of the first extending pads are larger than lengths of the second extending pads;
- and
- a capacitor structure comprising a plurality of bottom electrodes disposed on the connecting layer, wherein the connecting pads respectively have one of the bottom electrodes disposed thereon, the first extending pads respectively have a number N+1 of the bottom electrodes disposed thereon, wherein the number N is an integer number of 0, 1, or 2, the second extending pads respectively have the number N of the bottom electrodes disposed thereon.
Dependencies are inferred from the claim text.