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US 12,743,020 B2Granted
Apparatus for treating substrate and method for treating a substrate
AssigneeSemes Co., Ltd.
InventorsSoo Bin Yong, Min Jung Park
Life of this patent
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Abstract
The inventive concept provides a substrate treating method. The substrate treating apparatus includes supplying a first liquid to a rotating substrate to treat a substrate; and supplying a second liquid which is different from the first liquid to the rotating substrate to coat the substrate with the second liquid, and wherein a rotation direction of the substrate is different at the supplying the first liquid and at the supplying the second liquid.
Claims12
A substrate treating method comprising:
- supplying a first liquid to a rotating substrate to treat a substrate;
- and
- supplying a second liquid which is different from the first liquid to the rotating substrate to coat the substrate with the second liquid, and
- wherein a rotation direction of the substrate is different at the supplying the first liquid and at the supplying the second liquid, liquid,
- wherein the supplying the first liquid includes
- firstly supplying the first liquid on the rotating substrate to form a liquid film on the substrate, and
- secondly supplying the first liquid on the substrate having the liquid film formed thereon, after the firstly supplying the first liquid,
- wherein the firstly supplying the first liquid and the secondly supplying the first liquid is performed before the supplying the second liquid,
- wherein the substrate is rotated in a first direction at the firstly supplying the first liquid and the supplying the second liquid, and
- the substrate is rotated in a second direction which is different from the first direction at the secondly supplying the first liquid.
7 more elements
A substrate treating method comprising:
- hydrophilizing a substrate by supplying a thinner to a rotating substrate;
- coating the substrate with a photoresist liquid by supplying the photoresist liquid to the rotating substrate;
- and
- post-treating the substrate, and
- wherein the post-treating the substrate includes
- diffusing the photoresist liquid supplied onto the substrate by rotating the substrate,
- adjusting a thickness of the photoresist liquid supplied to the substrate by rotating the substrate,
- removing the photoresist liquid remaining on an edge region of the substrate by supplying the thinner on the rotating substrate, and
- removing the thinner from the substrate by rotating the substrate,
- wherein a rotation direction of the substrate is changed at any one of the hydrophilizing the substrate or the post-treating the substrate,
- wherein the hydrophilizing the substrate includes
- firstly supplying the thinner to the rotating substrate to form a liquid film on the substrate,
- firstly forming the liquid film on the substrate by rotating the substrate in a state in which a supply of the thinner is stopped,
- secondly supplying the thinner to the substrate on which the liquid film is formed after the firstly supplying the liquid film, and
- secondly forming the liquid film on the substrate by rotating the substrate in a state in which the supply of the thinner is stopped,
- wherein the substrate is rotated in a first direction at each of the firstly supplying the thinner, the firstly forming the liquid film, the coating the substrate, the diffusing the photoresist liquid, and the post-treating the substrate, and
- the substrate is rotated in a second direction which is an opposite direction from the first direction at each of the secondly supplying the thinner and the secondly forming the liquid film.
14 more elements
A substrate treating method comprising:
- hydrophilizing a substrate by supplying a thinner to a rotating substrate;
- coating the substrate with a photoresist liquid by supplying the photoresist liquid to the rotating substrate;
- and
- post-treating the substrate,
- wherein the post-treating the substrate includes
- diffusing the photoresist liquid supplied onto the substrate by rotating the substrate,
- adjusting a thickness of the photoresist liquid supplied to the substrate by rotating the substrate,
- removing the photoresist liquid remaining on an edge region of the substrate by supplying the thinner on the rotating substrate, and
- removing the thinner from the substrate by rotating the substrate
- wherein a rotation direction of the substrate is changed at any one of the hydrophilizing the substrate or the post-treating the substrate, and
- wherein the substrate rotates in a first direction at each of the hydrophilizing the substrate, the coating the substrate, the diffusing the photoresist liquid, and the adjusting the thickness, and
- the substrate rotates in a second direction which is an opposite direction of the first direction at the removing the photoresist liquid and the removing the thinner.
9 more elements
Dependencies are inferred from the claim text.