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AssigneeTaiyo Ink Mfg. Co., (Korea) Ltd.
InventorsSeok Bong Lim, Jong Chul Kwon, Young Ho Sa, Jin Kim, Byeong Jun Choi, Joon Seok Kim, Jun Young Hwang, Na Ra Lee, So Young Kim
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The present invention relates to a solder resist composition, and more specifically, to: a solder resist composition that can be used to obtain high reflectance, excellent yellowing resistance, excellent crack resistance, high resolution and flatness, excellent sensitivity, developability, adhesion, solder heat resistance, pencil hardness, solvent resistance, HAST resistance, and high reflectance and high gloss after a HAST test; a dry film and a printed wiring board which include a solder resist layer obtained therefrom; and methods for manufacturing same. The solder resist composition according to the present invention can provide a dry film and a printed wiring substrate which have a solder resist layer, wherein the solder resist layer has excellent sensitivity, developability, adhesion, solder heat resistance, and solvent resistance, has high reflectance, experiences only a small decrease in reflectance even after high-temperature reflow and UV post-curing, experiences only a small decrease in reflectance even after being irradiated with blue light for 3000 hours, has excellent yellowing resistance and crack resistance, has excellent flatness and gloss, and has high resolution.
A solder resist composition comprising (A) a carboxyl group-containing resin not containing an aromatic ring, (B) an inorganic filler, (C) a mercapto-modified acrylate and (D) a resin containing an aromatic ring, wherein the content of (C) the mercapto-modified acrylate is from 2% by mass to 6% by mass based on the total composition in terms of solids content.
Dependencies are inferred from the claim text.