Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsHayato Tanoue, Yohei Yamashita
Life of this patent
Estimating the term…
Abstract
A substrate processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other is provided. A laser absorption layer is formed on the second substrate. The substrate processing method includes forming a separation modification layer by radiating a laser beam to the laser absorption layer in a pulse shape to accumulate a stress in the laser absorption layer; and separating the second substrate by releasing the accumulated stress in a chain manner.
Claims26
A substrate processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other,
- wherein a laser absorption layer is formed on the second substrate, and
- wherein the substrate processing method comprises:
- forming a separation modification layer by radiating a laser beam to the laser absorption layer in a pulse shape;
- radiating the laser beam in a pulse shape while forming the separation modification layer such that the separation modification layer does not overlap with another separation modification layer;
- accumulating a stress in the laser absorption layer;
- and
- separating the second substrate by releasing the accumulated stress in a chain manner.
A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other,
- wherein a laser absorption layer is formed on the second substrate,
- wherein the substrate processing apparatus comprises:
- a laser radiation unit configured to radiate a laser beam in a pulse shape to the laser absorption layer of the second substrate;
- and
- a controller configured to control an operation of the laser radiation unit, and
- wherein the controller controls the operation of the laser radiation unit to perform formation of a separation modification layer by radiation of the laser beam, to radiate the laser beam in a pulse shape while forming the separation modification layer such that the separation modification layer does not overlap with another separation modification layer, and to accumulate a stress in the laser absorption layer by, and then, to perform separation of the second substrate by release of the accumulated stress in a chain manner.
Dependencies are inferred from the claim text.