Heat-dissipating waterproof structure
AssigneeNEC Platforms, Ltd.
InventorsTakahiro Yagi, Kiyotaka Yokoyama, Akira Katsumata, Wataru Imura
Life of this patent
Estimating the term…
Loading patent…
AssigneeNEC Platforms, Ltd.
InventorsTakahiro Yagi, Kiyotaka Yokoyama, Akira Katsumata, Wataru Imura
Estimating the term…
Provided is a heat-dissipating waterproof structure having both excellent heat dissipation ability and high waterproofness. A heat-dissipating waterproof structure (300) provided between a top part (203) of a casing (200) to accommodate a heat source (102) and the heat source (102) includes a water receiving part (301) that guides a liquid having entered into the casing (200) through an outlet (203A) provided in the top part (203) of the casing (200), and a water guide channel (302) that guides the liquid having been guided by the water receiving part (301) to be discharged to outside of a space where the heat source (102) is accommodated, and the water receiving part (301) has at least a sloping surface which gradually becomes higher the further it is from being immediately above the heat source (102).
A heat-dissipating waterproof structure provided between a top part of a casing to accommodate a heat source and the heat source, comprising:
The heat-dissipating waterproof structure according to 1, wherein
The heat-dissipating waterproof structure according to 1, wherein
Dependencies are inferred from the claim text.