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US 12,729,437 B2Granted
Method and system for depositing boron nitride using pulsed chemical vapor deposition
AssigneeASM IP Holding B.V.
InventorsRené Henricus Jozef Vervuurt, Timothee Blanquart
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Abstract
Methods and systems for depositing a boron nitride film on a substrate are disclosed. More particularly, the disclosure relates to methods and systems that can be used for depositing a boron nitride film by a pulsed CVD process.
Claims16
A cyclic deposition method of depositing a boron nitride film on a surface of a substrate,
- the method comprising:
- providing the substrate in a reaction chamber, the reaction chamber comprising a gas distribution assembly, a susceptor, and a reaction space;
- providing a reactant into the reaction space;
- forming a plasma within the reaction space between the gas distribution assembly and the susceptor using the reactant;
- and
- pulsing a precursor into the reaction space to thereby form the boron nitride film,
- wherein the precursor comprises boron and nitrogen;
- wherein the reactant is provided continuously during the pulsing of the precursor into the reaction chamber;
- wherein the reactant consists of 30-99% argon and/or helium and 1-70% hydrogen;
- and
- wherein the plasma is continuous during a plurality of steps of pulsing the precursor.
8 more elements
Dependencies are inferred from the claim text.