Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

An actinic ray-sensitive or radiation-sensitive resin composition comprising:

• a resin of which polarity increases through decomposition by an action of an acid;
• and
• a compound that generates an acid upon irradiation with actinic rays or radiation,
• wherein the compound that generates an acid upon irradiation with actinic rays or radiation includes any one or more of a compound (I) or a compound (II),
• Compound (I):
• a compound having one or more of the following structural moieties X and one or more of the following structural moieties Y, and an acid-decomposable group in which a polar group is protected by a leaving group that leaves by an action of an acid, where the compound generates an acid including the following first acidic moiety derived from the following structural moiety X and the following second acidic moiety derived from the following structural moiety Y upon irradiation with actinic rays or radiation,
• Structural moiety X:
• a structural moiety which consists of an anionic moiety A1− and a cationic moiety M1+, and forms a first acidic moiety represented by HA1 upon irradiation with actinic rays or radiation,
• Structural moiety Y:
• a structural moiety which consists of an anionic moiety A2− and a cationic moiety M2+, and forms a second acidic moiety represented by HA2 upon irradiation with actinic rays or radiation,
• provided that the compound (I) satisfies the following condition IA and condition IB,
• Condition IA:
• a compound PI formed by substituting the cationic moiety M1+ in the structural moiety X and the cationic moiety M2+ in the structural moiety Y with H+ in the compound (I) has an acid dissociation constant a1 derived from an acidic moiety represented by HA1, formed by substituting the cationic moiety M1+ in the structural moiety X with H+, and an acid dissociation constant a2 derived from an acidic moiety represented by HA2, formed by substituting the cationic moiety M2+ in the structural moiety Y with H+, and the acid dissociation constant a2 is larger than the acid dissociation constant a1,
• Condition IB:
• the compound (I) has a structure in which a site that links an anionic moiety A1− in one or more structural moieties X and an anionic moiety A2− in one or more structural moieties Y by an action of an acid is not cleaved,
• in the compound (I), at least one of the cationic moiety M1+ or the cationic moiety M2+ has the acid-decomposable group, and the acid-decomposable group represents a group represented by Formula (1) or (2),
• in Formula (1), R11 to R13 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, furthermore, two of R11 to R13 may be bonded to each other to form a ring, and * represents a bonding site,
• in Formula (2), R2 represents an alkyl group or a cycloalkyl group, R3 represents a hydrogen atom, an alkyl group, or a cycloalkyl group, R2 and R3 may be bonded to each other to form a ring, and * represents a bonding site,
• Compound (II):
• a compound having two or more of the structural moieties X, and one or more of the following structural moieties Z, and an acid-decomposable group in which a polar group is protected by a leaving group that leaves by an action of an acid, where the compound generates an acid including two or more of the first acidic moieties derived from the structural moiety X and the structural moiety Z upon irradiation with actinic rays or radiation,
• Structural moiety Z:
• a nonionic moiety capable of neutralizing an acid,
• provided that the compound (II) satisfies the following condition IIB, and
• Condition IIB:
• the compound (II) has a structure in which a site that links an anionic moiety A1− in two or more structural moieties X and the structural moiety Z is not cleaved by an action of an acid,
• in the compound (II), at least one of the cationic moieties M1+ has the acid-decomposable group.