Composite abrasive, method of preparing same, polishing slurry including same, and method of manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsSang Soo Jee, Eun Sung Lee, Junghoon Lee, Youngnam Kwon
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Abstract
Provided are a composite abrasive, a method of preparing same, polishing slurry including same, and a method of manufacturing a semiconductor device using the polishing slurry, the composite abrasive including a host material and abrasive particles protruding from the surface of the host material. The host material may have a Mohs hardness smaller than a Mohs hardness of the abrasive particles. The host material may have a two-dimensional planar structure and/or a layered structure. A binding force between the host material and the abrasive particles may be greater than or equal to about 200 nN.
Claims20
A composite abrasive, comprising:
- a host material having a two-dimensional planar structure, a layered structure, or both, and
- abrasive particles protruding from an exposed surface of the host material into an external environment that is external to the composite abrasive,
- wherein the host material defining the exposed surface of the host material has a Mohs hardness smaller than a Mohs hardness of the abrasive particles.
A composite abrasive, comprising:
- a host material;
- and
- abrasive particles protruding from a surface of the host material,
- wherein a binding force between the host material and the abrasive particles is greater than or equal to about 200 nN.
Dependencies are inferred from the claim text.