Method for laser-based singulating of microchips on structured substrates

Abstract

The subject-matter of this disclosure is a method for singulating microchips. The method includes providing a single-layer or multi-layer substrate. The method further includes laser-based creating microcracks in the substrate using a laser beam that penetrates the substrate, wherein the laser beam is guided laterally around the microchips so as to generate singulating scribe lines in the substrate along which the microchips are to be singulated. The laser beam is guided laterally across the substrate in multiple passes, wherein the focal point of the laser beam is set to different penetration depths in different passes each so that the microcracks generated in the focal point are generated in the substrate in a step-wise manner. According to the disclosure, at least one recess is generated in the substrate, wherein the recess extends at least partially in a lateral direction along one of the singulating scribe lines.

Dependencies are inferred from the claim text.