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US 12,720,713 B1Granted
Moat heatsink for VRs in high power AI servers
AssigneeAMD Design, LLC
InventorsSruti Chigullapalli, Sunilkumar Pinnu, Wojciech Marcin Serafin, Cong Yao
Life of this patent
Estimating the term…
Abstract
An apparatus is provided for cooling a first heat source surrounded by a plurality of second heat sources in which a second heat sink for the plurality of heat sources is attached to a first heat sink connected to the first heat source. The apparatus avoids requiring dedicated mounts on the device for the second heat sink by employing the first heat sink to effectively sandwich the second heat sink against the plurality of heat sources. Embodiments further enhance the heat transfer by distributing heat pipes within fins of the first heat sink and by facing two sides of the first heat sink to create a duct through which airflow is channeled.
Claims19
An apparatus comprising:
- a first heat sink including a first plurality of fins and a base, the first plurality of fins having a plurality of tubes that extend to the base of the first heat sink, the base being configured to connect to a first heat source;
- a second heat sink including a face, the second heat sink being connected to the base of the first heat sink;
- a plurality of springs biasing the face of the second heat sink away from the base of the first heat sink along a first axis, the plurality of springs being configured to urge the face of the second heat sink against a second heat source when the base of the first heat sink is connected to the first heat source;
- and
- a plurality of fasteners configured to pass through the plurality of tubes and engage first heat source mounting holes such that when the fasteners are passed through the plurality of tubes and engage the first heat source mounting holes, the base of the first heat sink is connected to the first heat source and at least part of the face of the second heat sink is between the base of the first heat sink and the second heat source, which compresses the plurality of springs and urges the face of the second heat sink against the second heat source.
2 more elements
A system comprising:
- a circuit board mounted to a chassis, the circuit board having a first heat source and at least one second heat source;
- a heatsink assembly including i) a first heat sink having a first plurality of fins and a base, the first plurality of fins having a plurality of tubes that extend to the base of the first heat sink, the first heat sink being mounted to and in thermal contact with the first heat source, ii) a second heat sink in thermal contact with the second heat source and having a face, the second heat sink being connected to the base of the first heat sink, iii) a plurality of springs configured to bias the second heat sink face away from the first heat sink base and toward the second heat source along a first axis, and iv) a plurality of fasteners passing through the plurality of tubes and engaging first heat source mounting holes, the base of the first heat sink being connected to the first heat source and at least part of the face of the second heat sink being between the base of the first heat sink and the second heat source thereby compressing the plurality of springs and urging the face of the second heat sink against the second heat source.
A method comprising:
- providing a heatsink assembly including:
- i) a first heat sink having a first plurality of fins and a base, the first plurality of fins having a plurality of tubes that extend to the base of the first heat sink, the base being configured to connect to a first heat source, ii) a second heat sink having a face, the second heat sink being connected to the base of the first heat sink, iii) a plurality of springs configured to bias the face of the second heat sink away from the base of the first heat sink along a first axis, and iv) a plurality of fasteners configured to pass through the plurality of tubes and engage first heat source mounting holes;
- mounting the base of the first heat sink to the first heat source on a circuit board by passing the fasteners through the plurality of tubes to engage the first heat source mounting holes such that the first plurality of fins is in thermal contact with the first heat source through the base of the first heat sink and at least part of the face of the second heat sink is between the base of the first heat sink and a second heat source thereby enabling transfer of heat from the first heat source to the base of the first heat sink;
- and
- compressing the plurality of springs along the first axis during the mounting of the first heat sink to the first heat source to urge the face of the second heat sink against the second heat source and thereby enable transfer of heat from the second heat source to the face of the second heat sink.
2 more elements
Dependencies are inferred from the claim text.