Polishing composition, method for producing polishing composition, and polishing method
AssigneeFujimi Incorporated
InventorsKyosuke Tenko, Jun Ito, Daisuke Yasui, Hitoshi Morinaga
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Abstract
Provided is a polishing composition with excellent machining capacity, and good cleaning property after polishing. A polishing composition containing abrasive grains, water, and a hydrophobic dispersing medium, wherein the hydrophobic dispersing medium contains at least one selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a flash point of 30° C. or more and 100° C. or less, or a vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.
Claims18
A polishing composition comprising abrasive grains, water, and a hydrophobic dispersing medium,
- wherein the hydrophobic dispersing medium comprises at least two organic solvents selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a FPI flash point of 30° C. or more and 100° C. or less,
- wherein the hydrophobic dispersing medium comprises:
- an organic solvent having a flash point of more than 45° C. and 65° C. or less, or an organic solvent having a flash point of more than 65° C. and less than 100° C.;
- and
- an organic solvent having a flash point of 100° C. or more and 180° C. or less.
A polishing composition comprising abrasive grains, water, and a hydrophobic dispersing medium,
- wherein the hydrophobic dispersing medium comprises at least two organic solvents selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a mixed vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less,
- wherein the hydrophobic dispersing medium comprises:
- an organic solvent having a vapor pressure at 20° C. of 0.01 kPa or more and 0.1 kPa or less;
- and
- an organic solvent having a vapor pressure at 20° C. of 0.001 kPa or less.
A method for producing a polishing composition, comprising:
- a step of providing a hydrophobic dispersing medium comprising at least two organic solvents selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and
- wherein the hydrophobic dispersing medium has a mixed vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less, and comprises:
- an organic solvent having an organic solvent having a vapor pressure at 20° C. of 0.01 kPa or more and 0.1 kPa or less;
- and
- an organic solvent having a vapor pressure at 20° C. of 0.001 kPa or less;
- and/or
- wherein the hydrophobic dispersing medium has a FPI flash point of 30° C. or more and 100° C. or less, and comprises:
- an organic solvent having a flash point of more than 45° C. and 65° C. or less, or an organic solvent having a flash point of more than 65° C. and less than 100° C.;
- and
- an organic solvent having a flash point of 100° C. or more and 180° C. or less;
- and
- a step of mixing the hydrophobic dispersing medium, water, and abrasive grains.
Dependencies are inferred from the claim text.