Inkjet printing equipment

An inkjet printing equipment comprising:

• a work holder configured to fix an object to be printed;
• a work holder moving part configured to allow the work holder to be linearly movable in a Y-axis direction;
• a base on which the work holder moving part is installed;
• a head part installed on the base, and configured to spray an ink onto the object to be printed;
• a head part moving part configured to move the head part in an X-axis direction, and installed above the base;
• an ink curing part installed above the work holder and on a moving path of the work holder in the Y-axis direction;
• and
• an enclosure configured to cover all of the work holder, the head part, and the ink curing part,
• wherein the work holder includes:
• a wafer support part installed on the work holder moving part;
• a first upward moving part installed inside the wafer support part;
• and
• a work holder body installed above the first upward moving part,
• wherein the first upward moving part is provided to allow the work holder body to be movable in a Z-axis direction,
• wherein the work holder body includes:
• support columns extending from an upper portion of a first support plate in the Z-axis upward direction;
• and
• a wafer support plate installed on an upper end of the support columns,
• wherein the support columns are provided in four and installed at corners to correspond, respectively, to the wafer support rods provided on the support,
• wherein the support columns are provided at positions such that, when the work holder body moves in the Z-axis direction, an interference of the horizontal support does not occur,
• wherein a support rod guide groove, which extends in the Z-axis direction so that when the work holder body moves in the Z-axis direction, each of the wafer support rods is guided, is defined in an inner side of each of the support columns,
• wherein the work holder further includes a work holder cover part,
• wherein the work holder cover part includes a first cover part configured to cover the wafer support part and the first upward moving part, and a second cover part configured to cover the work holder body,
• wherein the first cover part has an upper portion that is opened to be fixed to the work holder moving part,
• wherein an opened groove, which has an upper portion that is opened so that the work holder body is movable in the Z-axis direction, is defined in an upper portion of the first cover part,
• wherein a first sealing is installed along an inner perimeter of the opened groove,
• wherein an opened portion is defined so that upper and lower portions of the second cover part are opened,
• wherein the upper portion of the second cover part is fixed to the wafer support plate so that when the work holder body moves in the Z-axis direction, the second cover part moves together,
• wherein a first flange having a flat plate shape is provided along a lower perimeter of the second cover part so as to be in contact with the first sealing when the work holder body moves upward.