Systems, devices, and methods for compensating for shape variations when using image-based alignment to align bonding pads
AssigneeCanon Kabushiki Kaisha
InventorNilabh K. Roy
Life of this patent
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Abstract
Some devices, systems, and methods for aligning a chiplet to a substrate obtain an image of a region on a chiplet, measure a deviation from planarity of the region on the chiplet, estimate a chiplet-position error of the chiplet based at least on the image of the region and the deviation from planarity of the region, and adjust a relative position of the chiplet and a substrate based on the chiplet-position error.
Claims19
A method of aligning a chiplet to a substrate, the method comprising:
- obtaining an image of a region on a chiplet;
- measuring a deviation from planarity of the region on the chiplet;
- estimating a chiplet-position error of the chiplet based on the image of the region and the deviation from planarity of the region, wherein estimating the chiplet-position error comprises:
- obtaining an observed alignment error of the region based on the image of the region,
- calculating a component of the observed alignment error that is caused by the deviation from planarity of the region, and
- calculating an in-plane alignment error by subtracting the component from the observed alignment error;
- and
- controlling at least one of a bonding head that holds the chiplet or a substrate stage that holds the substrate to adjust a relative position of the chiplet and the substrate based on the chiplet-position error.
A system comprising:
- one or more processors;
- and
- one or more memories, wherein the one or more processors and the one or more memories are configured to:
- obtain an image of a region on a chiplet;
- measure a deviation from planarity of the region on the chiplet;
- calculate a chiplet-position error of the chiplet based on the image of the region and the deviation from planarity of the region, wherein, to calculate the chiplet-position error, the one or more processors and the one or more memories are configured to:
- obtain an observed alignment error of the region based on the image of the region,
- calculate a component of the observed alignment error that is caused by the deviation from planarity of the region, and
- calculate an in-plane alignment error by subtracting the component from the observed alignment error;
- and
- control at least one of a bonding head that holds the chiplet or a substrate stage that holds a substrate to adjust a relative position of the chiplet and the substrate based on the chiplet-position error.
One or more non-transitory computer-readable storage media storing instructions that, when executed by one or more computing devices, cause the one or more computing devices to perform operations comprising:
- obtaining an image of a region on a chiplet;
- measuring a surface relief of the region on the chiplet;
- calculating a chiplet-position error of the chiplet based on at least the image of the region, the surface relief of the region, and a reference surface, wherein calculating the chiplet-position error comprises:
- obtaining an observed alignment error of the region based on the image of the region,
- calculating a component of the observed alignment error that is caused by the surface relief of the region, and
- calculating an in-plane alignment error by subtracting the component from the observed alignment error;
- calculating a position-adjustment value for the chiplet based on the chiplet-position error;
- and
- controlling at least one of a bonding head that holds the chiplet or a substrate stage that holds a substrate to adjust a relative position of the chiplet and the substrate based on the position-adjustment value.
Dependencies are inferred from the claim text.