Wet processing system and nozzle for dispensing a liquid laterally across a semiconductor wafer
AssigneeTokyo Electron Limited
InventorRonald Nasman
Life of this patent
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Abstract
The present disclosure provides improved wet processing systems and methods for processing a semiconductor wafer. More specifically, the present disclosure provides various embodiments of improved wet processing systems, liquid dispense nozzles and methods for dispensing a liquid that flows laterally across a surface of a semiconductor wafer with uniform flow velocity. The disclosed embodiments utilize a wafer support mechanism for supporting a semiconductor wafer and at least one elongated nozzle for dispensing a liquid onto the wafer support mechanism, such that the liquid flows in a lateral direction across the surface of the semiconductor wafer with uniform flow velocity across a direction perpendicular to the lateral direction.
Claims21
A wet processing system, comprising:
- a wafer support mechanism having a planar surface with a recess formed in the planar surface, wherein the recess is configured to support a semiconductor wafer, and wherein a surface of the semiconductor wafer is substantially flush with the planar surface of the wafer support mechanism when the semiconductor wafer is supported within the recess;
- and
- at least one elongated nozzle coupled to the wafer support mechanism, wherein the at least one elongated nozzle is configured to dispense a liquid onto the planar surface of the wafer support mechanism, wherein the liquid flows in a lateral direction across the surface of the semiconductor wafer with uniform flow velocity across a direction perpendicular to the lateral direction, and wherein the at least one elongated nozzle comprises:
- an elongated output slot configured to dispense the liquid onto the planar surface of the wafer support mechanism with the uniform flow velocity;
- and
- a pattern of fluid flow obstructions, which regulate a flow velocity of the liquid passing through the at least one elongated nozzle to ensure that the liquid is dispensed from the elongated output slot with the uniform flow velocity.
A wet processing system, comprising:
- a wafer support mechanism having a planar surface with a recess configured to support a semiconductor wafer, wherein a surface of the semiconductor wafer is substantially flush with the planar surface of the wafer support mechanism when the semiconductor wafer is supported with the recess;
- and
- at least one elongated nozzle coupled to the wafer support mechanism, wherein the at least one elongated nozzle is configured to dispense a liquid onto the planar surface of the wafer support mechanism, wherein the liquid flows in a lateral direction across the surface of the semiconductor wafer with uniform flow velocity across a direction perpendicular to the lateral direction, and wherein the at least one elongated nozzle comprises:
- a high conductance fluid flow path coupled to receive the liquid from a liquid supply line;
- an elongated output slot configured to dispense the liquid onto the planar surface of the wafer support mechanism with the uniform flow velocity;
- and
- a low conductance fluid flow path coupled between the high conductance fluid flow path and the elongated output slot, wherein the low conductance fluid flow path comprises a pattern of fluid flow obstructions, which regulate a flow velocity of the liquid passing through the low conductance fluid flow path to ensure that the liquid is dispensed from the elongated output slot with the uniform flow velocity.
Dependencies are inferred from the claim text.