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US 12,677,354 B2Granted
Wiring sheet
AssigneeLintec Corporation
InventorsTakuya Oshima, Takashi Morioka
Life of this patent
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Abstract
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C. of the cured product layer is in a range from 5.0×106 Pa to 1.0×1010 Pa.
Claims11
A wiring sheet comprising:
- a sheet structure comprising a plurality of conductive linear bodies arranged at intervals;
- a cured product layer supporting the sheet structure;
- and
- a pair of electrodes in direct contact with the conductive linear bodies, wherein
- the cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C. of the cured product layer is in a range from 5.0×106 Pa to 1.0×1010 Pa.
2 more elements
Dependencies are inferred from the claim text.