Semiconductor device and method of forming the same

A method of forming a semiconductor device, comprising:

• providing a substrate;
• forming a plurality of plugs on the substrate;
• and
• forming a storage node pad structure on the substrate, the storage node pad structure comprising:
• a plurality of first extension pads separated from each other and arranged as an array, wherein the plurality of first extension pads is electrically connected with the plurality of plugs, respectively;
• a margin extension pad disposed outside the plurality of first extension pads;
• a plurality of second extension pads disposed between the margin extension pad and the plurality of first extension pads;
• and
• a plurality of third extension pads disposed between the margin extension pad and the plurality of first extension pads, wherein a maximum distance from an end of one of the plurality of second extension pads to a lateral side of the margin extension pad, which is nearest to the end, is equal to a maximum distance from an end of one of the plurality of third extension pads to the lateral side of the margin extension pad, and wherein a first included angle between a shorter side of one of the plurality of second extension pads and the lateral side of the margin extension pad is less than 90 degrees, and a second included angle between a shorter side of one of the plurality of third extension pads and the lateral side of the margin extension pad is less than 90 degrees.