Board testing apparatus and board testing method

A board testing apparatus that inspects a printed circuit board on which solder paste is printed, the board testing apparatus comprising:

• an image obtaining device that obtains an image of an inspection object area in the printed circuit board, wherein the inspection object area includes a component mounting area where a component of the printed circuit board is mounted;
• and
• a control device that:
• detects a foreign substance in the inspection object area based on the image,
• determines that the foreign substance is defective upon detecting that the foreign substance overlaps the component mounting area or is adjacent to the component mounting area when a lump part of the foreign substance has an area greater than an area threshold value or a length greater than a length threshold value, and
• determines that the foreign substance is non-defective upon detecting that the foreign substance neither overlaps the component mounting area nor is adjacent to the component mounting area even when the lump part of the foreign substance has the area greater than the area threshold value or the length greater than the length threshold value.