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US 12,655,988 B2Granted
Appliance
AssigneeLG Electronics Inc.
InventorsMyeongsu Shin, Wanglim Lee, Janghoon Kim, Chan-Yong Yeo
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to an appliance. The appliance includes; a main body that has a first accommodation space therein, and a first sensing module that is disposed at the main body in a way that the first sensing module is disposed outside the first accommodation space. Since a sensor is disposed to avoid the effect of heat as described above, the sensor is much less likely to operate improperly or be broken because of heat.
Claims20
An appliance, comprising:
- a main body having an accommodation space;
- a door configured to open and close the accommodation space;
- and
- a first sensing module configured to sense a vibration of the door, and installed on the main body;
- and
- a second sensing module configured to sense a state of open and closing the door, and installed on the main body,
- wherein the first sensing module and the second sensing module contact a rear surface of the door when the door closes the accommodation space, and
- wherein the first sensing module includes:
- an input switch that contacts the rear surface of the door when the door closes the accommodation space and is configured to transfer the vibration from the door;
- a transfer rod movably installed on the main body and configured to transfer the vibration from the input switch;
- and
- a sensor installed on the main body and configured to sense the vibration transferred from the transfer rod,
- wherein the input switch includes a moving member movably installed to protrude from the main body, and an elastic member configured to provide a force to move the moving member toward the rear surface of the door.
10 more elements
Dependencies are inferred from the claim text.