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US 12,649,870 B2Granted
Substrate for release sheets, and release sheet
AssigneeLintec Corporation
InventorsKoji Tsuchibuchi, Kiichiro Kato
Life of this patent
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Abstract
A substrate may be suitable for release sheet and may include, in this order, a support, an adhesion layer (X1), and a resin layer (Y1) containing polyethylene having a density of 930 kg/m3 or more and 960 kg/m3 or less, wherein convex portions are present on the surface of the resin layer (Y1). A difference in height of the convex portions may be 0.5 μm or more.
Claims20
A substrate suitable for a release sheet, the substrate comprising, in this order:
- a resin layer (Y2);
- an adhesion layer (X2);
- a support;
- an adhesion layer (X1);
- and
- a resin layer (Y1) comprising a polyethylene having a density in a range of from 930 to 960 kg/m3,
- wherein the support consists of a plastic film,
- wherein an absolute value of a difference between a first total thickness (Y1t+X1t) of the layer (Y1) and the layer (X1) and a second total thickness (Y2t+X2t) of the layer (Y2) and the layer (X2) is in a range of from 0 to 50 μm,
- wherein convex portions are present on a surface of the resin layer (Y1),
- wherein a difference in height of the convex portions is 0.5 μm or more,
- wherein a width of the convex portions is in a range of from 1.0 to 30.0 μm,
- wherein the support, the adhesion layer (X1), and the resin layer (Y1) are directly laminated, and
- wherein the support, the adhesion layer (X2), and the resin layer (Y2) are directly laminated.
10 more elements
Dependencies are inferred from the claim text.