Temperature regulating apparatus for semiconductor-device manufacturing equipment, and semiconductor-device manufacturing system

A temperature regulating apparatus for regulating a temperature of semiconductor-device manufacturing equipment, comprising:

• a heating section configured to produce a heating liquid;
• a cooling section configured to produce a cooling liquid;
• a heating-liquid delivery pipe coupled to the heating section, the heating-liquid delivery pipe being configured to deliver the heating liquid to the semiconductor-device manufacturing equipment;
• a cooling-liquid delivery pipe coupled to the cooling section, the cooling-liquid delivery pipe being configured to deliver the cooling liquid to the semiconductor-device manufacturing equipment;
• a heating-side return pipe coupled to the heating section, the heating-side return pipe being configured to return a liquid mixture of the heating liquid and the cooling liquid that have passed through the semiconductor-device manufacturing equipment to the heating section;
• a cooling-side return pipe coupled to the cooling section, the cooling-side return pipe being configured to return the liquid mixture that has passed through the semiconductor-device manufacturing equipment to the cooling section;
• and
• at least one of a heating-side heat exchanger arranged to preheat the liquid mixture before returning to the heating section with heat of the heating liquid by exchanging heat between the heating liquid flowing through the heating-liquid delivery pipe and the liquid mixture flowing through the heating-side return pipe, and a cooling-side heat exchanger arranged to precool the liquid mixture before returning to the cooling section with cold of the cooling liquid by exchanging heat between the cooling liquid flowing through the cooling-liquid delivery pipe and the liquid mixture flowing through the cooling-side return pipe.