Heat dissipation mechanism and electronic device thereof
AssigneeWistron Corporation
InventorsTsung-Hsien Chen, Chia-Cheng Su, Po-Yuan Hsu, Wan-Xuan Wang
Life of this patent
Estimating the term…
Abstract
A heat dissipation mechanism is applied to an electronic device and includes a sheltering component, a division component, a blade, a driving component and an actuating module. The division component is disposed inside the sheltering component. The blade is pivoted to the division component. The driving component is movably disposed on the division component and connected to the blades. The actuating module is connected to the driving component. The blade is driven by the actuating module to rotate relative to the division component via the driving component.
Claims20
A heat dissipation mechanism comprising:
- a sheltering component;
- a division component disposed on the sheltering component in a spaced manner;
- a blade pivoted to the division component;
- a driving component movably disposed on the division component and connected to the blade;
- and
- an actuating module connected to the driving component;
- wherein, the blade and the driving component are respectively disposed on two opposite sides of the division component, and the blade is driven by the actuating module to rotate relative to the division component via the driving component.
An electronic device comprising:
- a case comprising a side plate;
- and
- a heat dissipation mechanism comprising:
- a sheltering component connected to the side plate;
- a division component disposed on the sheltering component in a spaced manner;
- a blade pivoted to the division component;
- a driving component movably disposed on the division component and connected to the blade;
- and
- an actuating module connected to the driving component;
- wherein, the blade and the driving component are respectively disposed on two opposite sides of the division component, and the blade is driven by the actuating module to rotate relative to the division component via the driving component.
An electronic device comprising:
- a case comprising a side plate, a first heat dissipation hole being formed on the side plate;
- a fan disposed inside the case;
- and
- a heat dissipation mechanism comprising:
- a sheltering component connected to the side plate to form a slot body, the slot body comprising an slot inner wall, and a second heat dissipation hole being formed on the slot inner wall;
- a division component disposed inside the slot body of the sheltering component;
- a blade pivoted to the division component;
- a driving component movably disposed on the division component and connected to the blade;
- and
- an actuating module connected to the driving component;
- wherein the fan faces the second heat dissipation hole, and the second heat dissipation hole faces the first heat dissipation hole, the blade is disposed between the first heat dissipation hole and the second heat dissipation hole, the blade is driven by the actuating module to rotate relative to the first heat dissipation hole and the second heat dissipation hole via the driving component.
Dependencies are inferred from the claim text.