Curable resin, curable resin composition, and cured product
AssigneeDIC Corporation
InventorsRyuichi Matsuoka, Lichen Yang, Hiroyoshi Kannari
Life of this patent
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Abstract
An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R1, R2, R3, k, and X are as described herein.
Claims16
A curable resin comprising a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below:
- in General Formulae (1) and (2) above, R1s each independently represent an alkyl group with a carbon number of 1 to 12, an aryl group, an aralkyl group, or a cycloalkyl group;
- k indicates an integer of 1 to 3;
- R2s each independently represent a hydrogen atom or a methyl group;
- X represents a vinylbenzyl ether group;
- and in General Formula (2) above, R3s each independently represent a hydrogen atom, an alkyl group with a carbon number of 1 to 12, an aryl group, an aralkyl group, a cycloalkyl group, or an alkenyl group.
Dependencies are inferred from the claim text.