Systems and methods for spacer for power module for inverter for electric vehicle
AssigneeBorgWarner US Technologies LLC
InventorEdward Choi
Life of this patent
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Abstract
A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module for an inverter for an electric vehicle, the power module comprising: a first substrate having an outer layer and an inner layer; a first electrically conductive spacer coupled to the inner layer of the first substrate; a first semiconductor die coupled to the first electrically conductive spacer; and a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.
Claims19
A system comprising:
- an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes:
- a power module comprising:
- a first substrate having an outer layer and an inner layer;
- a first electrically conductive spacer coupled to the inner layer of the first substrate;
- a first semiconductor die coupled to the first electrically conductive spacer;
- a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate;
- a second electrically conductive spacer coupled to the inner layer of the second substrate;
- and
- a second semiconductor die coupled to the second electrically conductive spacer and the inner layer of the first substrate.
A power module, the power module comprising:
- a first substrate having an outer layer and an inner layer;
- a first electrically conductive spacer coupled to the inner layer of the first substrate;
- a first semiconductor die coupled to the first electrically conductive spacer, wherein the first semiconductor die includes a source connection, and the source connection is coupled to the first electrically conductive spacer;
- and
- a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.
A power module, comprising:
- a first substrate;
- a second substrate;
- a semiconductor die disposed between the first substrate and the second substrate;
- and
- one or more electrically conductive spacers disposed between the semiconductor die and one or more of the first substrate and the second substrate,
- wherein the semiconductor die has a same surface area as a first electrically conductive spacer among the one or more electrically conductive spacers.
Dependencies are inferred from the claim text.