Trimming intermediate carbon layer to achieve nanometer scale patterning
AssigneeInternational Business Machines Corporation
InventorsLuxherta Buzi, Robert L. Bruce, Hiroyuki Miyazoe
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsLuxherta Buzi, Robert L. Bruce, Hiroyuki Miyazoe
Estimating the term…
Embodiments of include a technique for trimming an intermediate carbon layer by hydrogen (H2) plasma to achieve nanometer scale critical dimension patterning with high selectivity to metals and dielectrics. The technique includes providing a structure as a stack having at least one metal layer, a carbon layer, and at least one phase change material layer, the stack extending in a first dimension. The technique includes etching the carbon layer to a first width in a second dimension, the second dimension being perpendicular to the first dimension. The technique includes applying hydrogen plasma to laterally etch the carbon layer to a second width in the second dimension, the hydrogen plasma being applied with substantially no bias power and to avoid etching the at least one metal layer and the at least one phase change material layer.
A method comprising:
A method comprising:
A method comprising:
Dependencies are inferred from the claim text.