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US 12,615,707 B2Granted
Confinement and protection of a thermal interface material between a heat sink and an electronic device
AssigneeSuper Micro Computer, Inc.
InventorsYi-Kuan Liao, Kuan-Lin Peng
Life of this patent
Estimating the term…
Abstract
Disclosed is an electronic assembly that includes a heat sink with a groove that is cut on a surface of the heat sink. A thermal interface material is disposed between the heat sink and an electronic device. A compressible filler disposed in the groove surrounds and confines the thermal interface material.
Claims20
An electronic assembly comprising:
- a heat sink, the heat sink having a first groove that is cut on a surface of the heat sink;
- an electronic device;
- a thermal interface material that is disposed between the heat sink and the electronic device, the thermal interface material is attached to the surface of the heat sink and to a surface of the electronic device;
- and
- a compressible filler disposed in the first groove, the compressible filler completely surrounds the thermal interface material and confines the thermal interface material within a perimeter of the compressible filler,
- wherein the heatsink has a second groove that is cut on the surface of the heat sink directly adjacent to and within a perimeter of the first groove, the second groove is shallower than the first groove and contains a spillover portion of the thermal interface material that directly contacts the compressible filler.
3 more elements
An electronic assembly comprising:
- a heat sink having a continuous groove that is cut on a bottom surface of the heat sink;
- an electronic device;
- a thermal interface material that is disposed between the heat sink and the electronic device, wherein the thermal interface material directly contacts the bottom surface of the heatsink and directly contacts a top surface of the electronic device;
- and
- a compressible filler that is disposed in the continuous groove without an adhesive and completely surrounds the thermal interface material,
- wherein the heatsink has a spillover groove that is cut on the bottom surface of the heat sink directly adjacent to and within a perimeter of the continuous groove, the spillover groove is shallower than the continuous groove and contains a spillover portion of the thermal interface material that directly contacts the compressible filler.
3 more elements
Dependencies are inferred from the claim text.