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US 12,604,784 B2Granted
Stack packages and methods of manufacturing the same
AssigneeSK hynix Inc.
InventorsKi Jun Sung, Chae Sung Lee
Life of this patent
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Abstract
A stack package, and a method of manufacturing the same, includes a first encapsulant layer formed on a carrier. Also semiconductor dies are sequentially offset stacked on the first encapsulant layer. Vertical connectors connected to the semiconductor dies are formed. A second encapsulant layer coupled to the first encapsulant layer is formed to encapsulate the vertical connectors and the semiconductor dies. Redistribution layers connected to the vertical connectors are formed on the second encapsulant layer.
Claims18
A method of manufacturing a stack package, the method comprising:
- forming a first encapsulant layer on a carrier with a first adhesive layer directly therebetween;
- offset stacking semiconductor dies on the first encapsulant layer;
- forming vertical connectors connected to the semiconductor dies;
- forming a second encapsulant layer coupled to the first encapsulant layer and encapsulating the vertical connectors and the semiconductor dies;
- and
- forming redistribution layers connected to the vertical connectors on the second encapsulant layer,
- wherein forming the first encapsulant layer includes laminating a first encapsulant film to the carrier;
- wherein the first encapsulant film comprises an epoxy molding compound (EMC) film;
- and
- wherein the carrier and the first adhesive layer are removed from the first encapsulant layer and the EMC film remains coupled to the second encapsulant layer.
7 more elements
A method comprising:
- forming a first encapsulant layer on a carrier with a adhesive layer directly therebetween;
- disposing a first semiconductor die on the first encapsulant layer;
- stacking a second semiconductor die on the first semiconductor die with a first offset in a first direction;
- and
- stacking a third semiconductor die on the second semiconductor die with a second offset in second direction opposite to the first direction;
- and
- forming a first bonding wire connected to the first semiconductor die and extending substantially vertically past the third semiconductor die and the second semiconductor die;
- and
- forming a second bonding wire connected to the second semiconductor die and extending substantially vertically past the third semiconductor die;
- forming a second encapsulant layer encapsulating the first bonding wire, the second bonding wire, the first semiconductor die, the second semiconductor die, and the third semiconductor die,
- wherein forming the first encapsulant layer includes laminating a first encapsulant film to the carrier;
- wherein the first encapsulant film comprises an epoxy molding compound (EMC) film;
- and
- wherein the carrier and the adhesive layer are removed from the first encapsulant layer and the EMC film remains coupled to the second encapsulant layer.
11 more elements
A method comprising:
- disposing a first semiconductor die on a first encapsulant layer;
- stacking a second semiconductor die on the first semiconductor die with a first offset in a first direction;
- and
- stacking a third semiconductor die on the second semiconductor die with a second offset in second direction opposite to the first direction;
- and
- forming a first bonding wire connected to the first semiconductor die and extending substantially vertically near a first side of the third semiconductor die;
- and
- forming a second bonding wire connected to the second semiconductor die and extending substantially vertically past a second side the third semiconductor die, wherein the first side is opposite the second side,
- wherein the first encapsulant layer is formed by laminating a first encapsulant film to a carrier with a adhesive layer directly therebetween;
- wherein the first encapsulant film comprises an epoxy molding compound (EMC) film;
- and
- wherein the carrier and the adhesive layer are removed from the first encapsulant layer and the EMC film remains coupled to the second encapsulant layer.
9 more elements
Dependencies are inferred from the claim text.