Package structure including guiding patterns

A package structure, comprising:

• a wiring substrate comprising bonding regions, the die bonding regions being laterally spaced apart from each other by a separation region, wherein the wiring substrate further comprising auxiliary patterns distributed in the separation region;
• a first semiconductor die disposed on a first die bonding region among the die bonding regions and electrically connected to the wiring substrate, the first semiconductor die comprising a first group of conductive terminals and a second group of conductive terminals, and a first arrangement pitch of the first group of conductive terminals being greater than a second arrangement pitch of the second group of conductive terminals, wherein a height of the first group of conductive terminals is greater than a thickness of the auxiliary patterns;
• and
• a dielectric layer disposed between the first semiconductor die and the wiring substrate, wherein the dielectric layer covers and is in contact with the auxiliary patterns.

A package structure, comprising:

• a wiring substrate comprising conductive wirings and dummy patterns, wherein the dummy patterns are distributed on a surface of the wiring substrate and are electrically floating;
• a first semiconductor die disposed on the surface of the wiring substrate and electrically connected to the conductive wirings of the wiring substrate, wherein a height of the dummy patterns is less than a standoff distance between the first semiconductor die and the surface of the wiring substrate;
• a second semiconductor die disposed on the surface of the wiring substrate and electrically connected to the conductive wirings of the wiring substrate;
• and
• a dielectric layer comprising a first portion, a second portion and a connecting portion between the first portion and the second portion, wherein the first portion is disposed between the first semiconductor die and the wiring substrate, the second portion is disposed between the second semiconductor die and the wiring substrate, the connecting portion of the dielectric layer covers and is in contact with the dummy patterns.