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US 12,604,778 B2Granted
Electronic device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakashi Iwamoto
Life of this patent
Estimating the term…
Abstract
An electronic device includes a substrate, a base substrate, a metal connection body, a support body, a metal body, and a via. The substrate includes one main surface with a functional element and is a piezoelectric substrate or a compound semiconductor substrate. The substrate is mounted on the base substrate such that the one main surface faces the base substrate. The metal body is in contact with the support body and includes at least a portion extending to outside the substrate in plan view from the support body. The via connects the portion of the metal body outside the substrate and the base substrate to each other and has a higher thermal conductivity than the substrate.
Claims14
An electronic device comprising:
- a functional element substrate including a first main surface with a functional element provided thereon, the functional element substrate being a piezoelectric substrate or a compound semiconductor substrate;
- a base substrate on which the functional element substrate is mounted such that the first main surface faces the base substrate;
- a metal connection body electrically connecting the functional element and the base substrate to each other;
- a support body at a second main surface of the functional element substrate opposite to the first main surface, the support body having a higher thermal conductivity than the functional element substrate;
- a first metal body in contact with the support body, the first metal body including at least a portion that extends to outside the functional element substrate in plan view from the support body;
- a via connecting the portion of the first metal body outside the functional element substrate and the base substrate to each other, the via having a higher thermal conductivity than the functional element substrate;
- and
- a second metal body between the functional element and the metal connection body;
- wherein
- the first metal body extends across the functional element substrate in plan view from the support body;
- the portion of the first metal body outside the functional element substrate is located on both sides of opposing sides of the functional element substrate in plan view from the support body;
- the portion of the first metal body on the both sides is connected to the base substrate with the via interposed between the portion and the base substrate;
- the metal connection body extends from inside the functional element substrate in plan view from the support body to outside the functional element substrate;
- and
- the second metal body extends from inside the functional element substrate in plan view from the support body to outside the functional element substrate.
12 more elements
An electronic device comprising:
- a functional element substrate including a first main surface with a functional element provided thereon, the functional element substrate being a piezoelectric substrate or a compound semiconductor substrate;
- a base substrate on which the functional element substrate is mounted such that the first main surface faces the base substrate;
- a metal connection body electrically connecting the functional element substrate and the base substrate to each other;
- a support body at a second main surface of the functional element substrate opposite to the first main surface, the support body including at least one of a mixture of a metal and a resin, silicon, silicon carbide, boron nitride, aluminum nitride, silicon nitride, copper, or nickel;
- a first metal body in contact with the support body, the first metal body including at least a portion extending to outside the functional element substrate in plan view from the support body;
- a via connecting the portion of the first metal body outside the functional element substrate and the base substrate to each other, the via including one of a copper-based conductive paste solidified material and a silver-based conductive paste solidified material;
- and
- a second metal body between the functional element and the metal connection body;
- wherein
- the first metal body extends across the functional element substrate in plan view from the support body;
- the portion of the first metal body outside the functional element substrate is located on both sides of opposing sides of the functional element substrate in plan view from the support body;
- the portion of the first metal body on the both sides is connected to the base substrate with the via interposed between the portion and the base substrate;
- the metal connection body extends from inside the functional element substrate in plan view from the support body to outside the functional element substrate;
- and
- the second metal body extends from inside the functional element substrate in plan view from the support body to outside the functional element substrate.
12 more elements
Dependencies are inferred from the claim text.