Semiconductor package and method of fabricating the same

A semiconductor package, comprising:

• a first wiring structure which includes a first insulating layer and a first wiring pad inside the first insulating layer;
• a first semiconductor chip on the first wiring structure;
• a second wiring structure which is placed on the first semiconductor chip, wherein the second wiring structure includes a second insulating layer and a plurality of second wiring pads in the second insulating layer which each directly contact one surface of the first semiconductor chip;
• a connecting member placed between the first wiring structure and the second wiring structure;
• and
• a mold layer which covers the first semiconductor chip,
• wherein the one surface of the first semiconductor chip is isolated from direct contact with the mold layer.

A method of fabricating a semiconductor package, the method comprising:

• forming a first wiring structure, the first wiring structure including a first insulating layer and a first wiring pad inside the first insulating layer;
• forming a first semiconductor chip having a first thickness on the first wiring structure;
• forming a connecting member having a second thickness lower than the first thickness on the first wiring structure the first semiconductor chip;
• removing at least a part of the first semiconductor chip and the connecting member to expose one surface of the first semiconductor chip and one surface of the connecting member;
• and
• forming a second wiring structure on the first semiconductor chip, the second wiring structure including a second insulating layer and a plurality of second wiring pads inside the second insulating layer, the second insulating layer and the plurality of second wiring pads each directly contacting the one surface of the first semiconductor chip.