Chipset and method of manufacturing the same

A chipset, comprising:

• a logic chip, having a first device layer and a first substrate layer, and comprising a plurality of first bonding components disposed in the first device layer;
• an input/output chip, having a second device layer and a second substrate layer, and comprising a plurality of second bonding components disposed in the second device layer;
• and
• an interposer, having a third device layer and a third substrate layer, and comprising a plurality of third bonding components disposed in the third device layer,
• wherein the logic chip is directly bonded to a first portion of the plurality of third bonding components of the interposer in a pad-to-pad manner through a first portion of the plurality of first bonding components, and the input/output chip is directly bonded to a second portion of the plurality of third bonding components of the interposer in the pad-to-pad manner through the plurality of second bonding components,
• wherein at least a portion of the first portion of the plurality of third bonding components is connected to at least a portion of the second portion of the plurality of third bonding components through a first metal wiring in the interposer,
• wherein the third substrate layer of the interposer comprises a deep trench capacitor on one side adjacent to the third device layer, and the logic chip is directly bonded to a third portion of the plurality of third bonding components in the third device layer in the pad-to-pad manner through a second portion of the plurality of first bonding components, and the third portion of the plurality of third bonding components in the third device layer of the interposer is connected to the deep trench capacitor through a third metal wiring.